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Material
Thermal Conductivity
W/IN°C
Linear Thermal Expansion
ppm/°C
Silver 99.9%
Copper OFC
Tungsten
Aluminum 6061T6
Silicon (pure)
Molybdenum
Beryllia 95%
Tin
Solder 63Sn-37Pb
Alumina 96%
Lead
Solder 96.5Sn-3.5Ag
Epoxy Stycast 2850KT
Epoxy Stycast 2850MT
PC Board G-10 (unclad)
Epoxy Stycast 2850FT
RTV 1200 HTC
Glass
Epoxy Scotchcast 281
RTV 3120
RTV 615
10.500
10.000
4.250
3.96
3.700
3.400
3.000
1.600
1.270
.890
.880
.840
.106
.075
.052
.036
.036
.031
.013
.008
.005
23.5
17.0
4.5
23.5
3.0
5.1
7.5
23.5
25.0
6.4
29.0
30.0
28.8
29.2
21.1
29.0
80.0
3.3
150.0
350.0
270.0


Thermal Impedance Formula (for conduction)

Thermal Impedance Formula (for conduction)
Last revised: 25 Oct 2010