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Conductivity W/IN°C |
Thermal Expansion ppm/°C |
| Silver 99.9% Copper OFC Tungsten Aluminum 6061T6 Silicon (pure) Molybdenum Beryllia 95% Tin Solder 63Sn-37Pb Alumina 96% Lead Solder 96.5Sn-3.5Ag Epoxy Stycast 2850KT Epoxy Stycast 2850MT PC Board G-10 (unclad) Epoxy Stycast 2850FT RTV 1200 HTC Glass Epoxy Scotchcast 281 RTV 3120 RTV 615 |
10.000 4.250 3.96 3.700 3.400 3.000 1.600 1.270 .890 .880 .840 .106 .075 .052 .036 .036 .031 .013 .008 .005 |
17.0 4.5 23.5 3.0 5.1 7.5 23.5 25.0 6.4 29.0 30.0 28.8 29.2 21.1 29.0 80.0 3.3 150.0 350.0 270.0 |
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Thermal Impedance Formula (for conduction)
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